芯片(pian)(pian)結(jie)構(gou)有平(ping)(ping)(ping)面(mian)和(he)臺(tai)面(mian)之分(fen)，平(ping)(ping)(ping)面(mian)芯片(pian)(pian)工藝(yi)一般為淺(qian)結(jie)結(jie)構(gou)，臺(tai)面(mian)芯片(pian)(pian)工藝(yi)包含淺(qian)結(jie)和(he)深(shen)結(jie)結(jie)構(gou)，二者芯片(pian)(pian)工藝(yi)對應(ying)產品及功(gong)能用途有所不同，兩(liang)者技術各有特(te)點。平(ping)(ping)(ping)面(mian)工藝(yi)多(duo)適(shi)用于(yu) MOS管(guan)(guan)、IGBT等晶(jing)體(ti)管(guan)(guan)芯片(pian)(pian)、肖特(te)基二極(ji)(ji)管(guan)(guan)芯片(pian)(pian)以(yi)及部分(fen)功(gong)率二極(ji)(ji)管(guan)(guan)芯片(pian)(pian)制造；臺(tai)面(mian)工藝(yi)適(shi)用于(yu)FRD/FRED、TVS二極(ji)(ji)管(guan)(guan)、STD、穩壓二極(ji)(ji)管(guan)(guan)等大部分(fen)二極(ji)(ji)管(guan)(guan)GPP芯片(pian)(pian)制造。

鑒于功(gong)率半導體，尤(you)其是(shi)功(gong)率二極管器件應用領域廣泛，細分產(chan)品規格型號數(shu)量繁(fan)多(duo)，在(zai)(zai)行(xing)(xing)業內各家(jia)芯(xin)片制造公司均是(shi)結合(he)自身(shen)優勢，采用具有自身(shen)特(te)色(se)的具體工(gong)(gong)(gong)藝(yi)(yi)技術(shu)路(lu)徑。不同(tong)產(chan)品適用不同(tong)的最佳工(gong)(gong)(gong)藝(yi)(yi)路(lu)線，兩(liang)種(zhong)工(gong)(gong)(gong)藝(yi)(yi)技術(shu)合(he)理共存。自 20 世(shi)紀60年代平(ping)(ping)面(mian)工(gong)(gong)(gong)藝(yi)(yi)技術(shu)出現(xian)以來，平(ping)(ping)面(mian)工(gong)(gong)(gong)藝(yi)(yi)從未對功(gong)率二極管臺面(mian)工(gong)(gong)(gong)藝(yi)(yi)進(jin)行(xing)(xing)替代，平(ping)(ping)面(mian)工(gong)(gong)(gong)藝(yi)(yi)和(he)臺面(mian)工(gong)(gong)(gong)藝(yi)(yi)不存在(zai)(zai)更新迭代關系。 

在(zai)中(zhong)低(di)壓(ya)(ya)功(gong)率二極管(guan)制(zhi)(zhi)造方面(mian)(mian)，平(ping)面(mian)(mian)工(gong)(gong)藝(yi)僅應(ying)用(yong)于部分中(zhong)低(di)壓(ya)(ya)產(chan)(chan)品生產(chan)(chan)，應(ying)用(yong)范圍較(jiao)窄；多數(shu)中(zhong)低(di)壓(ya)(ya)產(chan)(chan)品采(cai)用(yong)GPP工(gong)(gong)藝(yi)，光(guang)阻法(fa)GPP工(gong)(gong)藝(yi)產(chan)(chan)品可(ke)與平(ping)面(mian)(mian)工(gong)(gong)藝(yi)產(chan)(chan)品具有(you)同(tong)(tong)等性能，制(zhi)(zhi)作過程較(jiao)為簡單，更加具有(you)成本優勢和競爭力。在(zai)高壓(ya)(ya)功(gong)率二極管(guan)制(zhi)(zhi)造方面(mian)(mian)，平(ping)面(mian)(mian)工(gong)(gong)藝(yi)生產(chan)(chan)高耐(nai)壓(ya)(ya)產(chan)(chan)品不可(ke)避免(mian)需要采(cai)用(yong)分壓(ya)(ya)環，甚至要采(cai)用(yong)多道分壓(ya)(ya)環設計，如果要獲得同(tong)(tong)等有(you)效(xiao)通流面(mian)(mian)積，平(ping)面(mian)(mian)工(gong)(gong)藝(yi)芯片(pian)尺寸(cun)要比光(guang)阻法(fa)GPP工(gong)(gong)藝(yi)芯片(pian)尺寸(cun)更大，且平(ping)面(mian)(mian)工(gong)(gong)藝(yi)制(zhi)(zhi)作過程復(fu)雜，成本較(jiao)高，不具有(you)競爭力，高壓(ya)(ya)產(chan)(chan)品行業很(hen)少采(cai)用(yong)平(ping)面(mian)(mian)工(gong)(gong)藝(yi)。

在(zai) FRD/FRED 芯片制造(zao)方面(mian)(mian)，平面(mian)(mian)工(gong)藝(yi)多適用于反向耐壓(ya)1200V 以下(xia)的續(xu)流管(guan)(guan)產(chan)(chan)品(pin)生產(chan)(chan)，用作整流二(er)極管(guan)(guan)、高頻二(er)極管(guan)(guan)、阻尼二(er)極管(guan)(guan)、 1200V 以上高壓(ya)續(xu)流管(guan)(guan)等領域(yu)時(shi)，多采(cai)(cai)用臺(tai)面(mian)(mian)工(gong)藝(yi)。在(zai)TVS二(er)極管(guan)(guan)芯片制造(zao)方面(mian)(mian)，平面(mian)(mian)工(gong)藝(yi)多適用于低壓(ya)小功率產(chan)(chan)品(pin)生產(chan)(chan)，主要在(zai)耳機、智能手(shou)環手(shou)表、手(shou)機等可穿戴(dai)類(lei)或便攜類(lei)消(xiao)費類(lei)電(dian)子產(chan)(chan)品(pin)中抗靜電(dian)保護作用；其他細(xi)分領域(yu)，TVS二(er)極管(guan)(guan)多采(cai)(cai)用臺(tai)面(mian)(mian)GPP工(gong)藝(yi)。在(zai)STD芯片制造(zao)方面(mian)(mian)，業內(nei)基(ji)本采(cai)(cai)用臺(tai)面(mian)(mian)GPP工(gong)藝(yi)。

關于芯片結構工藝方面的知識就分享到這兒了！想了解更多，可咨詢TVS二極管廠家東沃電子：137 5773 6996（微信同號）余工